FHR Sputtering System
a versatile sputtering system designed for deposition of common metals and insulators (i.e. Al, Au, Cr, ITO, Si, SiO2, Si3N4) on samples and substrates (up to a diameter of 4" =100 mm). The system consists of a load-lock chamber and a deposition chamber to preserve high vacuum conditions during deposition.
FHR | Site
Edmond J. Safra (Givat-Ram)
Nano Center